Today, the task is soldering the PIC board. I was supervise by the other practical students who has done the soldering process. The soldering process also requires me to read the student handbook given by Encik Mazran to study and understand more about soldering technique.
Soldering is accomplished by quickly heating the metal parts to be joined, and then applying a flux and a solder to the mating surfaces. The finished solder joint metallurgically bonds the parts - forming an excellent electrical connection between wires and a strong mechanical joint between the metal parts. Heat is supplied with a soldering iron or other means. The flux is a chemical cleaner which prepares the hot surfaces for the molten solder.
When soldering, the key points to remember are:
1. always keep the tip coated with a thin layer of solder
2. use fluxes that are as mild as possible but still provide a strong solder joint
3. keep temperature as low as possible while maintaining enough temperature to quickly solder a joint (2-3 seconds maximum for electronics soldering)
4. match the tips size to the work
5. use the tips with the shortest reach possible for maximum efficiency.
Right amount of solder:
a) minimum amount of solder
b) optimal
The result:
Bottom View
Top View
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